Samsung to build US chip factory for AMD and Nvidia — it will produce logic for HBM4

Samsung Electronics plans to begin construction of its second factory in Taylor, Texas, USA, in November 2026. Industry sources claim the company has finalized agreements to supply HBM base dies to AMD and Nvidia, though Samsung has not confirmed the product lineup for Fab 2.

Fab 2 will be equipped to manufacture chips using a 2 nm-class process technology. Equipment installation is scheduled to start in February 2029, with mass production slated for 2030. These dies will be placed beneath a vertical stack of DRAM chips and will manage data exchange with accelerators.

For the fourth-generation HBM, base dies incorporate more complex logic tailored to accelerator architectures. Meanwhile, Nvidia is promoting NVHBM, where the memory controller is moved from the GPU to the base die. If this approach becomes the standard, some observers estimate that Samsung’s advantage in designing and producing such dies may diminish.